Machine processing of silicon carbide blanks

In this captivating footage, witness the intricate machine processing of silicon carbide (SiC) blanks, transforming raw ingots into precision-engineered wafers vital for power electronics and semiconductor applications. The process begins with diamond wire sawing to slice the ultra-hard SiC boule into thin blanks, followed by multi-step grinding and lapping to achieve mirror-like flatness and minimal subsurface damage. Advanced chemical-mechanical polishing (CMP) then refines the surfaces to atomic-level smoothness, eliminating defects while preserving the material's exceptional thermal conductivity and hardness—key for high-voltage devices operating beyond 600°C. Throughout, automated systems employ abrasive techniques like honing and controlled water jets to navigate SiC's extreme brittleness, yielding defect-free substrates that outperform traditional silicon in efficiency and reliability. This cutting-edge workflow underscores SiC's role in revolutionizing electric vehicles, renewable energy, and aerospace technologies.